Methods and apparatus for reading memory device register data

ABSTRACT

A methods and apparatus for reading register data from a memory device and outputting the register data to external data terminals of the memory device that outputs a first set of data bits from a memory array to the external terminals responsive to a first addressing signal. A register stores data, and outputs a second set of data bits responsive to a second addressing signal. A coupling circuit receives the second set of data bits, processes the data bits, and outputs a third set of data bits corresponding to the second set of data bits responsive to an enabling signal. A data path circuit that is coupled to the memory array to receive the first set of data bits is coupled to the coupling circuit to receive the third plurality of data bits, and to the external terminals. The data path circuit transmits the data bits received to the external terminals of the memory device.

TECHNICAL FIELD

[0001] This invention relates generally to memory devices used in computer systems, and more particularly, to methods and apparatus for reading register data from registers within the memory device.

BACKGROUND OF THE INVENTION

[0002] Conventional computer systems include a processor (not shown) coupled to a variety of memory devices, including read-only memories (“ROMs”) which traditionally store instructions for the processor, and a system memory to which the processor may write data and from which the processor may read data. The processor may also communicate with an external cache memory, which is generally a static random access memory (“SRAM”). The processor also communicates with input devices, output devices, and data storage devices.

[0003] Processors generally operate at a relatively high speed. Processors such as the Pentium® and Pentium II® microprocessors are currently available that operate at clock speeds of at least 400 MHz. However, the remaining components of existing computer systems, with the exception of SRAM cache memory, are not capable of operating at the speed of the processor. For this reason, the system memory devices, as well as the input devices, output devices, and data storage devices, are not coupled directly to the processor bus. Instead, the system memory devices are generally coupled to the processor bus through a memory controller, bus bridge or similar device, and the input devices, output devices, and data storage devices are coupled to the processor bus through a bus bridge. The memory controller allows the system memory devices to operate at a clock frequency that is substantially lower than the clock frequency of the processor. Similarly, the bus bridge allows the input devices, output devices, and data storage devices to operate at a frequency that is substantially lower than the clock frequency of the processor. Currently, for example, a processor having a 300 MHz clock frequency may be mounted on a mother board having a 66 MHz clock frequency for controlling the system memory devices and other components.

[0004] Access to system memory is a frequent operation for the processor. The time required for the processor, operating, for example, at 300 MHz, to read data from or write data to a system memory device operating at, for example, 66 MHz, greatly slows the rate at which the processor is able to accomplish its operations. Thus, much effort has been devoted to increasing the operating speed of system memory devices.

[0005] System memory devices are generally dynamic random access memories (“DRAMs”). Initially, DRAMs were asynchronous and thus did not operate at even the clock speed of the motherboard. In fact, access to asynchronous DRAMs often required that wait states be generated to halt the processor until the DRAM had completed a memory transfer. However, the operating speed of asynchronous DRAMs was successfully increased through such innovations as burst and page mode DRAMs, which did not require that an address be provided to the DRAM for each memory access. More recently, synchronous dynamic random access memories (“SDRAMs”) have been developed to allow the pipelined transfer of data at the clock speed of the motherboard. However, even SDRAMs are typically incapable of operating at the clock speed of currently available processors. Thus, SDRAMs cannot be connected directly to the processor bus, but instead must interface with the processor bus through a memory controller, bus bridge, or similar device. The disparity between the operating speed of the processor and the operating speed of SDRAMs continues to limit the speed at which processors may complete operations requiring access to system memory.

[0006] A solution to this operating speed disparity has been proposed in the form of a packetized memory device known as a SLDRAM memory device. In the SLDRAM architecture, the system memory may be coupled to the processor, either directly through the processor bus or through a memory controller. Rather than requiring that separate address and control signals be provided to the system memory, SLDRAM memory devices receive command packets that include both control and address information. The SLDRAM memory device then outputs or receives data on a data bus that may be coupled directly to the data bus portion of the processor bus.

[0007] An example of a computer system 10 using the SLDRAM architecture is shown in FIG. 1. The computer system 10 includes a processor 12 having a processor bus 14 coupled to three SLDRAM packetized dynamic random access memory devices 16 a-c through a memory controller 18. The computer system 10 also includes one or more input devices 20, such as a keypad or a mouse, coupled to the processor 12 through the processor bus 14, a bus bridge 22, and an expansion bus 24, such as an Industry Standard Architecture (“ISA”) bus or a Peripheral Component Interconnect (“PCI”) bus. The input devices 20 allow an operator or an electronic device to input data to the computer system 10. One or more output devices 30 are coupled to the processor 12 to display or otherwise output data generated by the processor 12. The output devices 30 are coupled to the processor 12 through the expansion bus 24, bus bridge 22 and processor bus 14. Examples of output devices 24 include printers and a video display units. One or more data storage devices 38 are coupled to the processor 12 through the processor bus 14, bus bridge 22, and expansion bus 24 to store data in or retrieve data from storage media (not shown). Examples of storage devices 38 and storage media include fixed disk drives floppy disk drives, tape cassettes and compact-disk read-only memory drives.

[0008] In operation, the processor 12 sends a data transfer command via the processor bus 14 to the memory controller 18, which, in turn, communicates with the memory devices 16 a-c via the system memory bus 23 by sending the memory devices 16 a-c command packets that contain both control and address information. Data is coupled between the memory controller 18 and the memory devices 16 a-c through a data bus portion of the system memory bus 23. During a read operation, data is transferred from the SLDRAMs 16 a-c over the memory bus 23 to the memory controller 18 which, in turn, transfers the data over the processor 14 to the processor 12. The processor 12 transfers write data over the processor bus 14 to the memory controller 18 which, in turn, transfers the write data over the system memory bus 23 to the SLDRAMs 16 a-c. Although all the memory devices 16 a-c are coupled to the same conductors of the system memory bus 23, only one memory device 16 a-c at a time reads or writes data, thus avoiding bus contention on the memory bus 23. Bus contention is avoided by each of the memory devices 16 a-c on the system memory 22 having a unique identifier, and the command packet contains an identifying code that selects only one of these components.

[0009] The computer system 10 also includes a number of other components and signal lines that have been omitted from FIG. 1 in the interests of brevity. For example, as explained below, the memory devices 16 a-c also receive a command clock signal to provide internal timing signals, a data clock signal clocking data into the memory device 16, and a FLAG signal signifying the start of a command packet.

[0010] A typical command packet CA<0:39> for a SLDRAM packetized DRAM is shown in FIG. 2 and is formed by four packet words CA<0:9>, each of which contains 10 command bits. As will be explained in more detail below, each packet word CA<0:9> is applied on a command-address bus CA that includes ten lines CA0-CA9. In FIG. 2, the four packet words CA<0:9> comprising a command packet CA<0:39> are designated PW₁-PW₄. The first packet word PW₁ contains 7 bits identifying the packetized DRAM 16 a-c that is the intended recipient of the command packet. Each of the packetized DRAMs is provided with a unique ID code that is compared to the 7 ID bits in the first packet word PW₁. Thus, although all of the packetized DRAMs 16 a-c will receive the command packet, only the packetized DRAM 16 a-c having an ID code that matches the 7 ID bits of the first packet word PW₁ will respond to the command packet.

[0011] The remaining 3 bits of the first packet word PW₁ as well as 3 bits of the second packet word PW₂ comprise a 6 bit command. Typical commands are read and write in a variety of modes, such as accesses to pages or banks of memory cells. The remaining 7 bits of the second packet word PW₂ and portions of the third and fourth packet words PW₃ and PW₄ comprise a 20 bit address specifying a bank, row and column address for a memory transfer or the start of a multiple bit memory transfer. In one embodiment, the 20-bit address is divided into 3 bits of bank address, 10 bits of row address, and 7 bits of column address.

[0012] Although the command packet shown in FIG. 2 is composed of 4 packet words each containing up to 10 bits, it will be understood that a command packet may contain a lesser or greater number of packet words, and each packet word may contain a lesser or greater number of bits.

[0013] One of the memory devices 16 a is shown in block diagram form in FIG. 3. Each of the memory devices 16 a-c includes a clock generator circuit 40 that receives a command clock signal CMDCLK and generates an internal clock signal ICLK and a large number of other clock and timing signals to control the timing of various operations in the memory device 16. The memory device 16 a also includes a command buffer 46 and an address capture circuit 48, which receive the internal clock signal ICLK, a command packet CA<0:9> on a 10-bit command-address bus 50, and a FLAG signal on line 52. A memory controller (not shown) or other device normally transmits the command packet CA<0:9> to the memory device 16 a in synchronism with the command clock signal CMDCLK. As explained above, the command packet CA<0:39>, which generally includes four 10-bit packet words, contains control and address information for each memory transfer. The FLAG signal identifies the start of a command packet, and it also signals the start of an initialization sequence. The command buffer 46 receives the command packet from the command-address bus 50, and compares at least a portion of the command packet to identifying data from an ID register 56 to determine if the command packet is directed to the memory device 16 a or some other memory device 16 b, 16 c. If the command buffer 46 determines that the command packet is directed to the memory device 16 a, it then provides the command words to a command decoder and sequencer 60. The command decoder and sequencer 60 generates a large number of internal control signals to control the operation of the memory device 16 a during a memory transfer.

[0014] The address capture circuit 48 also receives the command packet from the command-address bus 50 and outputs a 20-bit address corresponding to the address information in the command packet. The address is provided to an address sequencer 64, which generates a corresponding 3-bit bank address on bus 66, a 10-bit row address on bus 68, and a 7-bit column address on bus 70. The column address and row address are processed by column and row address paths 73, 75 as will be described in more detail below.

[0015] One of the problems of conventional DRAMs is their relatively low speed resulting from the time required to precharge and equilibrate circuitry in the DRAM array. The packetized DRAM 16 a shown in FIG. 3 largely avoids this problem by using a plurality of memory banks 80, in this case eight memory banks 80 a-h. After a read from one bank 80 a, the bank 80 a can be precharged while the remaining banks 80 b-h are being accessed. Each of the memory banks 80 a-h receives a row address from a respective row latch/decoder/driver 82 a-h. All of the row latch/decoder/drivers 82 a-h receive the same row address from a predecoder 84 which, in turn, receives a row address from either a row address register 86 or a refresh counter 88 as determined by a multiplexer 90. However, only one of the row latch/decoder/drivers 82 a-h is active at any one time, as determined by bank control logic 94 as a function of a bank address from a bank address register 96.

[0016] The column address on bus 70 is applied to a column latch/decoder 100, which supplies I/O gating signals to an I/O gating circuit 102. The I/O gating circuit 102 interfaces with columns of the memory banks 80 a-h through sense amplifiers 104. Data is coupled to or from the memory banks 80 a-h through the sense amplifiers 104 and the I/O gating circuit 102 and a data path subsystem 108, which includes a read data path 110 and a write data path 112. The read data path 110 includes a read latch 120 that stores data from the I/O gating circuit 102.

[0017] In the memory device 16 a shown in FIG. 3, 64 bits of data are stored in the read latch 120. The read latch then provides four 16-bit data words to an output multiplexer 122 that sequentially supplies each of the 16-bit data words to a read FIFO buffer 124. Successive 16-bit data words are clocked into the read FIFO buffer 124 by a clock signal DCLK generated by the clock generator 40. The 16-bit words are then clocked out of the read FIFO buffer 124 by a clock signal RCLK obtained by coupling the DCLK signal through a programmable delay circuit 126. The read FIFO buffer 124 sequentially applies the 16-bit words to a driver circuit 128 in synchronism with the RCLK signal. The driver circuit, in turn, applies the 16-bit data words to a data bus 130. The driver circuit 128 also applies the data clock signal DCLK to a clock line 132. The programmable delay circuit 126 is programmed during initialization of the memory device so that the DCLK signal has the optimum phase relative to DCLK signal for the DCLK signal to clock the read data into the memory controller (not shown), processor, or other device.

[0018] The write data path 112 includes a receiver buffer 140 coupled to the data bus 130. The receiver buffer 140 sequentially applies 16-bit words from the data bus 130 to four input registers 142, each of which is selectively enabled by a signal from a clock generator circuit 144. The clock generator circuit generates these enable signals responsive to the data clock DCLK, which, for write operations, is applied to the memory device 16 a on line 132 from the memory controller, processor, or other device. As with the command clock signal CMDCLK and command packet CA<0:9>, the memory controller or other device (not shown) normally transmits the data to the memory device 16 a in synchronism with the data clock signal DCLK. The clock generator 144 is programmed during initialization to adjust the timing of the clock signal applied to the input registers 142 relative to the DCLK signal so that the input registers can capture the write data at the proper times. Thus, the input registers 142 sequentially store four 16-bit data words and combine them into one 64-bit data word applied to a write FIFO buffer 148. The data are clocked into the write FIFO buffer 148 by a clock signal from the clock generator 144, and the data are clocked out of the write FIFO buffer 148 by an internal write clock WCLK signal. The WCLK signal is generated by the clock generator 40. The 64-bit write data are applied to a write latch and driver 150. The write latch and driver 150 applies the 64-bit write data to one of the memory banks 80 a-h through the I/O gating circuit 102 and the sense amplifiers 104.

[0019] As mentioned above, the memory device includes registers that store device parameters particular to the operation of that specific memory chip configuration. For example, the registers may store data indicative of the device configuration, data transfer format, speed capability, serial number, manufacturer, clock speed, etc. By way of further example, a register storing data indicative of the clock speed may be read to provide clock speed signals, MBPS400-800, that are used to time various signals as described in U.S. application Ser. No. 08/994,461, “Method and System for Processing Pipelined Memory Commands,” to Manning, which is incorporated herein by reference.

[0020] These registers may be programmed with appropriate data, using relatively simple circuitry so that relatively little circuitry must be added to the memory device to write data to the registers. Also, registers can be programmed during manufacture or test, so that no additional circuitry may be required to program the registers. However, circuitry must be added to the memory device to read the data from the registers. The need to add this readout circuitry can be problematic because the large amount of circuitry already present in state of the art memory devices minimizes the space available on a semiconductor die to add this additional circuitry. The readout circuitry can easily be added by making the size of the die larger. Doing so, however, reduces the number of dies that can be manufactured from each wafer, thus increasing the cost of such memory devices. A need therefore exists to be able to read data from on-board registers in memory devices without using a great deal of read-out circuitry.

[0021] Although the foregoing discussion is directed to reading register data in packetized memory devices, such as SLDRAMs, similar problems exist in other types of memory devices.

SUMMARY OF THE INVENTION

[0022] The present invention provides methods and apparatus for reading register data from a memory device and outputting the register data to external data terminals of the memory device, primarily using addressing and data path circuitry in the memory device that is normally used to read data from the memory device. As a result, it is not necessary to add a great deal of read-out circuitry where the memory device outputs a first set of data bits from a memory array to the external terminals responsive to a first addressing signal. A register stores data, and outputs a second set of data bits responsive to an addressing signal. A coupling circuit receives the second set of data bits, processes the data bits, and outputs a third set of data bits corresponding to the second set of data bits responsive to an enabling signal. A data path circuit that is coupled to the memory array to receive the first set of data bits is coupled to the coupling circuit to receive the third plurality of data bits, and to the external terminals. The data path circuit transmits the data bits received to the external terminals of the memory device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0023]FIG. 1 is a block diagram of a conventional computer system using a plurality of SLDRAM memory devices.

[0024]FIG. 2 is a diagram showing a typical command packet for a SLDRAM.

[0025]FIG. 3 is a block diagram of a conventional packetized DRAM used in the computer system of FIG. 1.

[0026]FIG. 4 is a functional block diagram of a register read system 200 according to one embodiment of the present invention.

[0027]FIG. 5 is a functional block diagram of one embodiment of a command decoder.

[0028]FIG. 6 is a logic diagram and schematic of one embodiment of an address selector.

[0029]FIG. 7 is a logic diagram and schematic of one embodiment of a portion of a register driver.

[0030]FIG. 8 is a functional block diagram showing one embodiment of the register read system of FIG. 4 in greater detail.

DETAILED DESCRIPTION OF THE INVENTION

[0031]FIG. 4 is a functional block diagram of a register read system 200 according to one embodiment of the present invention. The register read system 200 may be included in the memory device 16 in FIG. 3, and resulting memory device may be used in the computer system 10 shown in FIG. 1. With reference to Figure to 4, a memory controller 18 (not shown) applies command packets CA<0:39> containing a register address and FLAG bits to command buffer and address capture circuits 46, 48 via a command-address bus 50. The register address designates the location of stored data indicative of operating parameters, etc., stored in an on-board register.

[0032] With reference to FIG. 2, the register address may be contained in the packet using the bits normally reserved for the row address, for example, or other bit locations as appropriate. A command code bit in the command packet CA<0:39>, such as CMD<4>, is set HIGH to indicate a register read. Referring back to FIG. 4, an address selector 202 within the command buffer and address capture circuits 46, 48 (FIG. 3) receives the register address and CMD<4> bits. In response to the CMD<4> bit being HIGH, the address selector 202 transmits the register address onto a column address bus 70. The command buffer and address capture circuits 46, 48 also output an enabling signal, such as a tri-state DC sense amplifier signal TSDCSA, described below, and a command LCMD<1:3> that prevents a write operation from occurring in the memory device 16 during a register read. The LCMD<1:3> signal is explained in greater detail in U.S. application Ser. No. 08/994,461, “Method and System for Processing Pipelined Memory Commands,” to Manning, which is incorporated by reference, and will not be discussed further in the interest of brevity.

[0033] A decoder 204 receives the register address and selects a corresponding 32 bit register data set in a register 206. The register 206 outputs the register data set to a register driver 208. The register driver 208 also receives the tri-state DC sense amplifiers signal TSDCSA, which enables the register driver 208. When enabled, the register driver 208 reformats the 32 bit register data set to four 16 bit packets as described below, and outputs the reformatted register data set to an output data path 210. Other formatting is also possible. The output data path 210 serially couples the four 16 bit packets of the reformatted register data set to external data terminals DQ of the memory device 16. When disabled, the register driver 208 presents a tri-state condition to the output data path 210.

[0034] The output data path 210 includes the latch 120, multiplexer 122, output data buffer 124, and drivers 128 normally used in the memory device 10 of FIG. 3, although other components and configurations are also possible. These components 120-128 and their accompanying timing/load control circuit 220 may are described in detail in U.S. application Ser. No. 08/833,376, “Memory Device with Staggered Data Paths” to Manning which is herein incorporated by reference and is described only briefly below in the interest of brevity. Thus, the output data path 210 is the same data path used to output data bits stored in a memory array 80. Further, the operation of the data path 210 for a register read is the same as for a memory array read. Thus, most of the control signals that are generated for a memory array read can be used for a register read so that little additional control circuitry is required.

[0035] Although the register address is applied to the column address bus 70, which is coupled to the memory array 80, the memory array 80 is not activated. A column decoder 100 is coupled between the column address bus 70 and the memory array 80. The column decoder 100 receives the register address, and because the register address is not a recognized by the column decoder 100, the column decoder 100 does not activate a column within the memory array 80. Further, during a register read, the tri-state DC sense amplifier signal TSDCSA is applied to the sense amplifier 104 to place the sense amplifier 104 into a tri-state. This prevents the sense amplifier 104 from outputting data from the memory array 80 to the output data path 210, thereby preventing data contention with register data applied to the output data path 210. In addition, an input data path formed by the latches, drivers, and other circuitry 132-150 shown in FIG. 3 is deactivated when the CMD<4> bit is HIGH as described below during a register read.

[0036]FIG. 5 is a functional block diagram of one embodiment of a command decoder 230 that is typically part of the command buffer 46 (FIG. 3). The command decoder 230 receives the command packet CA<0:39> from the command-address bus 50. When the command bit CMD<4> of the command packet CA<0:39> is HIGH, indicating a register read, the command decoder 230 outputs a HIGH tri-state DC sense amplifier signal TSDCSA to the register driver 208 and the sense amplifier 104. The implementation of the command decoder 230 may be any of several appropriate methods known to those skilled in the art.

[0037]FIG. 6 is a logic diagram and schematic of one embodiment of the address selector 202. Bits from the command packet CA<0:39> that contain the register address, such as the ROW0-9 bits contained in the second and third packet words PW₂, PW₃, are applied to the inputs of a set of first pass gates 250 (only one of which is shown in FIG. 6). As mentioned above, the register address bits may be transmitted in other locations and be either a greater or lesser number of bits within the command packet CA<0:39> as appropriate. The CMD<4> bit from the command packet CA<0:39> is also transmitted to the address selector 202. The CMD<4> bit is applied to an inverter 252, and the CMD<4> bit and its complement (from the inverter) are applied to complementary control inputs of the first pass gate 250 and a set of second pass gates 254 (again, only one of which is shown).

[0038] The first pass gate 250 receives the register address and transmits it onto the column address bus 70 only when the CMD<4> bit is HIGH, indicating a register read. The second pass gate 254 receives bits from the command packet CA<0:39> containing the column address and transmits them onto the column address bus 70 only when the CMD<4> bit is LOW. Thus, the register address is output to the column address bus 70 when a register read occurs, and the column address is output during normal operation when a register read is not occurring. Typically, either the column address or the register address is present within the command packet CA<0:39>, but not both.

[0039] A set of third pass gates 256 (only one of which is shown) receives three of the command bits CMD<1:3> from the command packet CA<0:39>, and receives the CMD<4> bit and its complement at complementary control terminals. The third pass gate 256 transmits the command bits CMD<1:3> to other parts of the command buffer 46 (not shown) when the CMD<4> bit is LOW, i.e. during normal operation, and does not transmit when the CMD<4> bit is HIGH, i.e., during a register read.

[0040] A set of transistors 258 (only one of which is shown in FIG. 6), or other switching device, is coupled between the output of the third pass gates 256 and a biasing voltage, such as ground. The CMD<4> bit is applied to the gate of the transistor 258, turning the transistor 258 ON during a register read, thereby biasing the command bits CMD<1:3> output from the third pass gate 256 to a logic “0.” When grounded, the command bits CMD<1:3> disable the memory device 16 from receiving data bits on the input data path 132-150 (FIG. 3), i.e., prevent a write operation from occurring. The command bits CMD<1:3> also control other operations of the memory device 16 that are somewhat peripheral to the invention, and will not be discussed further in the interest of brevity.

[0041]FIG. 7 is a logic diagram and schematic of one embodiment of a portion of the register driver 208. The register driver 208 typically includes four coupling circuits 270, each of which includes sixteen conversion circuits 282, although either a greater or lesser number of coupling circuits 270 and conversion circuits 282 may be used as appropriate. Each of the coupling circuits 270, functions similarly, processing one fourth of the 32-bit register data set, and only one will be described in the interest of brevity.

[0042] The coupling circuit 270 receives the tri-state DC sense amplifier signal TSDCSA and eight data bits P0-7 of the 32-bit register data set from the register 206. Each data bit P0-7 is applied to a respective inverter 272 while the tri-state DC sense amplifier signal TSDCSA and its complement are applied to inputs of a respective NAND gate 274 and a NOR gate 276. When the TSDCSA signal and its compliment TSDCSA* are active high and low, respectively, the NAND gate 274 and the NOR gate 276 function as inverters. The NAND gate 274 and NOR gate 276 each also receive the output from the inverter 272. Thus, when the NAND gate 274 and the NOR gate 276 are enabled, the outputs of the NAND gate 274 and the NOR gate 276 will be LOW when the respective data bit P0-7 is LOW, and the outputs of the NAND gate 274 and the NOR gate 276 will be HIGH when the respective data bit P0-7 is HIGH. The output of the NAND gate 274 will be HIGH and the output of the NOR gate 276 will be LOW when the TSDCSA signal is inactive LOW.

[0043] The output from the NAND gate 274 is applied to a gate of a PMOS transistor 278 that has its source coupled to a voltage source, such as V_(CC), and its drain coupled to a drain of an NMOS transistor 280. The NMOS transistor 280 has a source coupled to another voltage source, such as ground, and a gate that receives the output from the NOR gate 276. The drains of the transistors 278, 280 are coupled to one line of a 64-bit bus 222.

[0044] In the operation of the coupling circuit 270, a data bit corresponding to the complement of the respective register bit P0-7 is output to a respective line D0-7 of the bus 222 when the tri-state DC sense amplifier signal TSDCSA is HIGH, i.e., when a register read occurs. When the tri-state DC sense amplifier signal TSDCSA is LOW, i.e., a register read is not occurring, both transistors 278, 280 are OFF, tri-stating the output of a conversion circuit 282. This is shown in Table 1, with a “*” representing the complement of the signal. TABLE 1 Output of the Conversion Circuit 282 TSDCSA OUTPUT low tri-state high input*

[0045] The conversion circuit 282 is repeated seven more times in the coupling circuit 270 to process the eight data bit portion P0-7 of the register data set output from the register 206. Because four coupling circuits 270 are used to process the 32-bit register data set, each coupling circuit 270 processes ¼ of the data set: 8 data bits.

[0046] The bus 222 is typically a 64-bit bus. Thus, while 32 bits are available from the register data set, 64 data bits must be transmitted on the bus 222. This is accomplished by each coupling circuit 270 accounting for 16 of the 64 bits even though each coupling circuit only receives 8 bits from the register 208.

[0047] Eight additional conversion circuits 282 are included in the coupling circuit 270. These conversion circuits 282 have their inputs to their respective inverters 272 coupled to a biasing voltage, such as V_(CC). These additional eight conversion circuits 282 thus output a logic “0” when a register read occurs, i.e., when the tri-state DC sense amplifier signal TSDCSA is HIGH, and otherwise are tri-stated. A total of 16 data bits per coupling circuit 270 are thus transmitted on the respective lines D0-15 of the bus 222. When four coupling circuits 270 are used as described above, the 32-bit register data set is converted into 64 bits for transmission on the bus 222.

[0048] Thus, the four coupling circuits 270 in the register driver 208 respectively process bits P0-7, P8-15, P16-23, and P24-31 of the 32 bit register data set, and respectively output bits to lines D0-15, D16-31, D32-47, and D48-63 of the bus 222.

[0049] Those skilled in the art will recognize that other logic configurations, types of transistors, and voltages may be substituted for the conversion circuit 282 without deviating from the scope of the invention. Similarly, a greater or lesser number of the data bits from the register 206, coupling circuits 270, conversion circuits 282, and data lines D0-63 may be used as appropriate.

[0050]FIG. 8 is a functional block diagram showing one embodiment of the register read system 200 of FIG. 4 in greater detail. During a register read, the register 206 outputs the 32-bit register data set P0-31 to four coupling circuits 270, eight bits to each coupling circuit 270. Each coupling circuit 270 outputs 16 bits to the bus 222: eight data bits corresponding to the bits from the register 206, and eight “filler” bits generated by the coupling circuit 270. The combined 64 bits are loaded into the latches 212 that includes four 16-bit latch circuits 300.

[0051] Each latch circuit 300 loads the data bits from the respective coupling circuit 270 in synchronization with one of a pair of load signals LDA, LDB, with the first and third latch circuits 300 controlled by the first load command LDA, and the second and fourth latch circuits 300 controlled by the second load command LDB. The load signals LDA, LDB and a control signal SEL<0:3>are generated by the timing control circuit 220 responsive to a clock signal CLK1. The timing control circuit 220 is described in greater detail in U.S. application Ser. No. 08/833,376, “Memory Device with Staggered Data Paths” to Manning, filed on Apr. 4, 1997, incorporated by reference. The loaded data bits are then applied to the multiplexer 122 which selects the data bits from one of the latch circuits 300 responsive to a control signal SEL<0:3>. The 16-bit packets from the four coupling circuits 270 are sequentially output by the multiplexer 122 to the output data buffer 124.

[0052] The output data buffer 124 sequentially applies the 16-bit words to the driver circuit 128 in synchronism with a second clock signal CLK2. The driver circuit 128, in turn, applies the 16-bit data words to the external data terminals via the data bus 130.

[0053] As mentioned above, the operation of the output data path 210 is described in greater detail in U.S. application Ser. No. 08/833,376, “Memory Device with Staggered Data Paths” to Manning, which was incorporated by reference.

[0054] The sense amplifier 104 includes four DC sense amplifiers 302 that are also coupled to the bus 222. As mentioned above, the tri-state DC sense amplifier signal TSDCSA goes HIGH when register read occurs, thereby placing each of the DC sense amplifiers 302 into a tri-state. This prevents the DC sense amplifiers 302 from applying data bits from the memory array 80 to the bus 222 during a register read.

[0055] From the foregoing it will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the invention is not limited except as by the appended claims. 

What is claimed is:
 1. A device for transmitting register data to external data terminals of a memory device, the memory device operable to output a first plurality of data bits from a memory array to the external terminals responsive to a first addressing signal, comprising: a register operable to store a second plurality of data bits and to output the second plurality of bits responsive to a second addressing signal; a coupling circuit coupled to the register to receive the second plurality of data bits, the coupling circuit operable to output a third plurality of bits corresponding to the second plurality of bits responsive to an enabling signal; and a data path circuit coupled to the memory array to receive the first plurality of data bits, to the coupling circuit to receive the third plurality of data bits, and to the external terminals, the data path circuit operable to transmit the data bits received to the external terminals of the memory device.
 2. The device of claim 1 wherein each of the third plurality of data bits respectively comprises the complement of each of the second plurality of data bits.
 3. The device of claim 1 wherein the coupling circuit comprises: a first plurality of bus driver stages, each of the first plurality of bus driver stages operable to output one of the third plurality of data bits corresponding to a respective one of the second plurality of data bits responsive to the enabling signal; and a second plurality of bus driver stages, each of the second plurality of bus driver stages operable to output a one of the third plurality of data bits responsive to the enabling signal, each of the data bits output by the second plurality of bus driver stages having a first logic level.
 4. The device of claim 3 wherein the first logic level comprises a logic zero.
 5. The device of claim 1 wherein each of the first plurality of bus driver stages comprises: an inverter operable to receive one of the second plurality of data bits and to generate the complement of the data bit in response to receiving the data bit; a nand gate coupled to the inverter to receive the complement of the data bit and operable to receive the enabling signal, the nand gate operable to produce a first output signal corresponding to the logic states of the complement of the data bit and the enabling signal; a nor gate coupled to the inverter to receive the complement of the data bit and operable to receive the complement of the enabling signal, the nor gate operable to produce a second output signal corresponding to the logic states of the complement of the data bit and the complement of the enabling signal; a first transistor having a gate, a source, and a drain the gate coupled to the nand gate to receive the first output signal, the source coupled to a first voltage source, the first transistor conducting when the first output signal is in a first state; and a second transistor having a gate, a source, and a drain, the gate coupled to the nor gate to receive the second output signal, the source coupled to a second voltage source, and the drain coupled to the drain of the first transistor, the second transistor conducting when the second output signal is in a second state, and the drain of the second transistor operable to generate one of the second plurality of data bits, each of the third plurality of data bits being output from the respective drain of the second transistor.
 6. The device of claim 1 wherein each of the second plurality of bus driver stages comprises: an inverter operable to be coupled to a third voltage source to receive a third voltage, and to generate the complement of the data bit in response to receiving the third voltage; a nand gate coupled to the inverter to receive the complement of the third voltage and operable to receive the enabling signal, the nand gate operable to produce a first output signal corresponding to the logic states of the complement of the third voltage and the enabling signal; a nor gate coupled to the inverter to receive the complement of the third voltage and operable to receive the complement of the enabling signal, the nor gate operable to produce a second output signal corresponding to the logic states of the complement of the third voltage and the complement of the enabling signal; a first transistor having a gate, a source, and a drain, the gate coupled to the nand gate to receive the first output signal, the source coupled to the first voltage source, the first transistor conducting when the first output signal is in a first state; and a second transistor having a gate, a source, and a drain, the gate coupled to the nor gate to receive the second output signal, the source coupled to a second voltage source, and the drain coupled to the drain of the first transistor, the second transistor conducting when the second output signal is in a second state, and the drain of the second transistor operable to generate one of the second plurality of data bits, each of the third plurality of data bits being output from the respective drain of the second transistor.
 7. The device of claim 1 wherein the second plurality of data bits comprises thirty two data bits.
 8. The device of claim 1 wherein the third plurality of data bits comprises sixty four data bits.
 9. The device of claim 1 wherein the data path circuit comprises a multiplexer coupled between the coupling circuit and the external terminals, the multiplexer operable to receive the third plurality of data bits and to sequentially output a plurality of portions of the third plurality of data bits responsive to a control signal, and operable to receive the first plurality of data bits from the memory device and to sequentially output a plurality of portions of the first plurality of data bits responsive to the control signal, the multiplexer operable to receive only one of the first and third pluralities of data bits at any given time.
 10. A device for transmitting register data to data terminals of a memory device, comprising: a column address bus operable to couple a register address signal; a decoder coupled to the column address bus to receive the register address signal and operable to produce a register address responsive to the register address signal; a register coupled to the decoder to receive the register address and operable to output a first plurality of data bits stored in the register corresponding to the register address; a register driver circuit coupled to the register to receive the first plurality of data bits, the register driver circuit operable to generate a respective second plurality of data bits corresponding to the first plurality of data bits responsive to a selector signal; a first set of interim storage latches coupled to the register driver circuit to receive a first portion of the second plurality of data bits, each interim storage latch in the first set operable to latch data from the register driver circuit responsive to a first activation signal; a second set of interim storage latches coupled to the register driver circuit to receive a second portion of the second plurality of data bits, each interim storage latch in the second set operable to latch data from the register driver circuit responsive to a second activation signal; a multiplexing circuit coupled to respective first latches to receive the first portion of the second plurality of data bits and to respective second latches to receive the second portion of the second plurality of data bits, the multiplexing circuit operable to sequentially transmit the first portion of the second plurality of data bits responsive to a control signal having a first state and the second portion of the second plurality of data bits responsive to the control signal having a second state; a timing control circuit operable to receive a first clock signal and to generate the first and second activation signals responsive to the first clock signal and to respectively apply the first and second activation signals to the first and second sets of latches, the timing control circuit further being responsive to the first clock signal to provide the control signal having the first state to the multiplexing circuit during a first portion of a selected clock cycle and to provide the control signal having the second state to the multiplexing circuit during a second portion of the selected clock cycle; an output data buffer coupled to the multiplexing circuit to sequentially receive the first and second portions of the second plurality of data bits, the output data buffer operable to sequentially transmit the first and second portions responsive to a second clock signal; a driver circuit coupled to the data terminals of the memory device, and to the output data buffer to receive the first and second portions of the second plurality of data bits, the driver circuit operable to sequentially transmit the first and second portions of the second plurality of data bits to the data terminals.
 11. The device of claim 10 wherein the driver circuit generates and transmits a data clock signal to at least one of the data terminals in synchronization with the transmission of the first and second portions of the second plurality of data bits.
 12. The device of claim 10 wherein: the output data buffer generates a third and fourth clock signals; and the driver circuit is coupled to the output data buffer to receive the third and fourth clock signals, and is operable to transmit the first and second portions of the second plurality of data bits responsive to the third and fourth clock signals.
 13. The device of claim 12 wherein the fourth clock signal comprises a quadrature clock with respect to the third clock signal.
 14. The device of claim 10 wherein the first address signal comprises a register address, and further comprising: an address selector circuit coupled between the decoder and the column address bus, the address selector circuit operable to receive a column address signal, the register address signal, and the selector signal, and operable to output the column address to the column address bus when the selector signal is in a first state, and to output the register address signal to the column address bus when the selector signal is in a second state.
 15. The device of claim 14, further comprising: a pass gate operable to receive the selector signal and a command signal, and to transmit the command signal to an output node responsive to the selector signal being in a first state, the command signal operable to cause the memory device to enter a condition that prevents data from being written to the memory device when the command signal is in a first state; and a write disabling circuit coupled to the output node of the pass gate, the write disabling circuit operable to receive the selector signal and to bias the command signal to the first state responsive to the selector signal being in a second state.
 16. The device of claim 15 wherein the first state of the command signal comprises a logic zero, and the write disabling circuit couples the output node of the pass gate to ground responsive to the selector signal being in the second state.
 17. The device of claim 15 wherein the write disabling circuit comprises a transistor coupled between the output node of the pass gate circuit and ground, the transistor operable to couple the output node to ground responsive to the selector signal being in the second state.
 18. The device of claim 14 wherein the first state of the selector signal comprises a logic zero and the second state of the selector signal comprises a logic one.
 19. The device of claim 14 wherein the address selector circuit comprises: an inverter operable to receive the selector signal and to generate the complement of the selector signal in response to receiving the selector signal; a first pass gate operable to receive the column address signal, the complement of the selector signal from the inverter, and the selector signal, and operable to couple the column address signal to the column address bus responsive to the selector signal having the first state; and a second pass gate operable to receive the register address signal, the complement of the selector signal from the inverter, and the selector signal, and operable to couple the register address signal to the column address bus responsive to the selector signal having the second state.
 20. The device of claim 10 wherein the register driver circuit comprises a plurality of register driver stages, one stage per each data bit of the first plurality of data bits, each register driver stage comprising: an inverter operable to receive one of the second plurality of data bits and to generate the complement of the data bit in response to receiving the data bit; a nand gate coupled to the inverter to receive the complement of the data bit and operable to receive the selector signal, the nand gate operable to produce a first output signal corresponding to the logic states of the complement of the data bit and the selector signal; a nor gate coupled to the inverter to receive the complement of the data bit and operable to receive the complement of the selector signal, the nor gate operable to produce a second output signal corresponding to the logic states of the complement of the data bit and the complement of the selector signal; a first transistor having a gate, a source, and a drain, the gate coupled to the nand gate to receive the first output signal, the source coupled to a first voltage source, the first transistor conducting when the first output signal is in a first state; and a second transistor having a gate, a source, and a drain, the gate coupled to the nor gate to receive the second output signal, the source coupled to a second voltage source, and the drain coupled to the drain of the first transistor, the second transistor conducting when the second output signal is in a second state, and the drain of the second transistor operable to generate one of the second plurality of data bits.
 21. The device of claim 20 wherein: the first output signal is in the first state when the first output signal comprises a logic zero and is in a second state when the first output signal comprises a logic one; and the second output signal is in a first state when the second output signal comprises a logic zero and is in the second state when the second output signal comprises a logic one.
 22. The device of claim 20 wherein the first voltage source comprises a relatively high voltage, and the second voltage source comprises a relatively low voltage.
 23. The device of claim 22 wherein the first voltage source comprises V_(CC) and the second voltage source comprises ground.
 24. The device of claim 20 wherein the register driver circuit further comprises a second plurality of register stages, each stage operable to produce a third plurality of data bits when the selector signal is in the second state; the first set of interim storage latches are further coupled to the register driver circuit to receive a first portion of the third plurality of data bits; the second set of interim storage latches are further coupled to the register driver circuit to receive a second portion of the third plurality of data bits; the multiplexing circuit is further coupled to respective first latches to receive the first portion of the second and third pluralities of data bits and to respective second latches to receive the second portion of the second and third pluralities of data bits, the multiplexing circuit operable to sequentially transmit the first portion of the second and third pluralities of data bits responsive to the first control signal and the second portion of the second and third pluralities of data bits responsive to the second control signal; the output data buffer is further coupled to the multiplexing circuit to sequentially receive the first and second portions of the second and third pluralities of data bits, and is operable to sequentially transmit the first and second portions responsive to the second clock signal; and the driver circuit is further coupled to the output data buffer to receive the first and second portions of the second and third pluralities of data bits, the driver circuit being operable to sequentially transmit the first and second portions of the second and third pluralities of data bits to the data terminals.
 25. The device of claim 24 wherein the each of the third plurality of data bits comprise a first logic level.
 26. The device of claim 25 wherein the first logic level comprises a logic zero.
 27. The device of claim 24 wherein the register driver circuit comprises a plurality of register driver stages, one stage per each data bit of the first plurality of data bits, each register driver stage comprising: an inverter operable to be coupled to a third voltage source to receive a third voltage, and to generate the complement of the data bit in response to receiving the third voltage; a nand gate coupled to the inverter to receive the complement of the third voltage and operable to receive the selector signal, the nand gate operable to produce a first output signal corresponding to the logic states of the complement of the third voltage and the selector signal; a nor gate coupled to the inverter to receive the complement of the third voltage and operable to receive the complement of the selector signal, the nor gate operable to produce a second output signal corresponding to the logic states of the complement of the third voltage and the complement of the selector signal; a first transistor having a gate, a source, and a drain, the gate coupled to the nand gate to receive the first output signal, the source coupled to the first voltage source, the first transistor conducting when the first output signal is in a first state; and a second transistor having a gate, a source, and a drain, the gate coupled to the nor gate to receive the second output signal, the source coupled to a second voltage source, and the drain coupled to the drain of the first transistor, the second transistor conducting when the second output signal is in a second state, and the drain of the second transistor operable to generate one of the second plurality of data bits.
 28. The device of claim 27 wherein the third voltage source comprises a voltage equivalent to a logic one.
 29. The device of claim 10 wherein each of the respective second plurality of data bits corresponds to the complement of the first plurality of data bits.
 30. The device of claim 10 wherein the first and second portions of the second plurality of data bits comprise the second plurality of data bits.
 31. The device of claim 10 wherein the memory device has a sense-amplifier circuit, and the register driver circuit is further coupled between the sense-amplifier circuit and the first and second sets of interim storage latches, the sense-amplifier circuit being disabled when the selector signal is in the second state.
 32. The device of claim 30 wherein the sense-amplifier circuit is tri-stated when disabled.
 33. A packetized dynamic random access memory, comprising: at least one array of memory cells operable to store a first plurality of data bits at respective locations determined by a row address and a column address; a row address circuit coupled to each array, the row address circuit operable to receive and decode the row address, and to select a row of memory cells corresponding to the row address responsive to a first set of command signals; a column address circuit coupled to each array, the column address circuit operable to receive data bits from or apply data bits to one of the memory cells in the selected row corresponding to the column address responsive to a second set of command signals; a command buffer operable to receive command packets and initialization packets, and to generate respective command words and initialization words corresponding to each received command packet and initialization packet, respectively; a register operable to store a second plurality of data bits and to output the second plurality of bits responsive to an addressing signal; a coupling circuit coupled to the register to receive either data bits from the memory cells of the array responsive to the second set of command signals or the second plurality of data bits from the register, the coupling circuit operable to output a third plurality of bits corresponding to the received data bits responsive to an enabling signal; and a data path circuit operable to couple the third plurality of bits from the coupling circuit to a data bus responsive to a third set of command signals.
 34. The packetized dynamic random access memory of claim 33 wherein the coupling circuit comprises: a first plurality of bus driver stages, each of the first plurality of bus driver stages operable to output one of the third plurality of data bits corresponding to a respective one of the second plurality of data bits responsive to the enabling signal; and a second plurality of bus driver stages, each of the second plurality of bus driver stages operable to output a one of the third plurality of data bits responsive to the enabling signal, each of the data bits output by the second plurality of bus driver stages having a first logic level.
 35. The packetized dynamic random access memory of claim 34 wherein the first logic level comprises a logic zero.
 36. The packetized dynamic random access memory of claim 33, further comprising a multiplexer coupled between the coupling circuit and the data bus, the multiplexer operable to receive the third plurality of data bits and to sequentially output to the data bus a plurality of portions of the third plurality of data bits responsive to a control signal, and operable to receive the first plurality of data bits from the memory device and to output to the data bus a plurality of portions of the first plurality of data bits responsive to the control signal, the multiplexer operable to receive only one of the first and third pluralities of data bits at any given time.
 37. A computer system, comprising: a processor having a processor bus; an input device coupled to the processor through the processor bus adapted to allow data to be entered into the computer system; an output device coupled to the processor through the processor bus adapted to allow data to be output from the computer system; and a packetized dynamic random access memory coupled to the processor bus, comprising, at least one array of memory cells operable to store a first plurality of data bits at respective locations determined by a row address and a column address; a row address circuit coupled to each array, the row address circuit operable to receive and decode the row address, and to select a row of memory cells corresponding to the row address responsive to a first set of command signals; a column address circuit coupled to each array, the column address circuit operable to receive or apply data to one of the memory cells in the selected row corresponding to the column address responsive to a second set of command signals; a command buffer operable to receive command packets and initialization packets, and to generate respective command words and initialization words corresponding to each received command packet and initialization packet, respectively; a register operable to store a second plurality of data bits and to output the second plurality of bits responsive to an addressing signal; a coupling circuit coupled to the register to receive either data bits from the memory cells of the array responsive to the second set of command signals or the second plurality of data bits from the register, the coupling circuit operable to output a third plurality of bits corresponding to the received data bits responsive to an enabling signal; and a data path circuit operable to couple the third plurality of bits from the coupling circuit to a data bus responsive to a third set of command signals
 38. The computer system of claim 37 wherein the coupling circuit comprises: a first plurality of bus driver stages, each of the first plurality of bus driver stages operable to output one of the third plurality of data bits corresponding to a respective one of the second plurality of data bits responsive to the enabling signal; and a second plurality of bus driver stages, each of the second plurality of bus driver stages operable to output a one of the third plurality of data bits responsive to the enabling signal, each of the data bits output by the second plurality of bus driver stages having a first logic level.
 39. The computer system of claim 38 wherein the first logic level comprises a logic zero.
 40. The computer system of claim 37, further comprising a multiplexer coupled between the coupling circuit and the data bus, the multiplexer operable to receive the third plurality of data bits and to sequentially output to the data bus a plurality of portions of the third plurality of data bits responsive to a control signal, and operable to receive the first plurality of data bits from the memory device and to output to the data bus a plurality of portions of the first plurality of data bits responsive to the control signal, the multiplexer operable to receive only one of the first and third pluralities of data bits at any given time.
 41. A method for reading register data of a memory device, the memory device operable to transmit data from a memory array in a predetermined format to an external terminal via an output data path, comprising: reading the contents of a register; converting the contents of the register to the predetermined format; decoupling the output data path from the memory array; and applying the contents of the register in the predetermined format to the external terminal via the output data path.
 42. The method of claim 41 wherein the predetermined format comprises a plurality of data bits in parallel.
 43. The method of claim 42 wherein the plurality of data bits comprises sixteen data bits.
 44. The method of claim 41 wherein converting the contents of the register to the predetermined format comprises: dividing the contents of the register into portions; and multiplexing the portions of the contents of the register.
 45. The method of claim 44 wherein dividing the contents of the register into portions comprises dividing the contents of the register into equal portions.
 46. A method for addressing a register of a memory device having a memory array operable to receive a memory address via an address bus, the method comprising: coupling the register to the address bus; and applying a register address to the address bus.
 47. The method of claim 46 wherein the register address is coupled to the address bus when the register is addressed, and otherwise is not coupled to the address bus.
 48. The method of claim 46 wherein the address bus comprises a column address bus and the memory address comprises a column address.
 49. The method of claim 46, further comprising: decoding the address applied to the address bus; and wherein applying the address to the register comprises applying the address to the register when the coded address has predetermined characteristics. 